Impact of Mask Roughness on Wafer Line-Edge Roughness
نویسنده
چکیده
The influence of line-edge roughness (LER) of an optical photomask on the resulting printed wafer LER is investigated. The LER Transfer function (LTF) proposed by Naulleau and Gallatin, and later corrected by Tanabe, is shown to be a very useful tool for evaluating the low-pass filtering behavior of the imaging tool and its impact on the transfer of mask LER to the wafer. Highfrequency mask LER can also impact wafer LER by lowering the normalized image log-slope (NILS) of the image, though it would take a large amount of mask LER before this affect would be noticeable. Low-frequency mask LER, most likely due to mask writer errors such as shot placement or rotation errors, will produce wafer LER that may be significant in magnitude. Further work characterizing the magnitude and frequency content of mask LER over many different masks and processes is needed.
منابع مشابه
System-level line-edge roughness limits in extreme ultraviolet lithography
As critical dimensions shrink, line edge and width roughness (LER and LWR) become of increasing concern. Traditionally LER is viewed as a resist-limited effect; however, as critical dimensions shrink and LER requirements become proportionally more stringent, system-level effects begin to play an important role. Recent advanced EUV resist testing results have demonstrated lower bounds on achieva...
متن کاملNeutral particle lithography: a simple solution to charge-related artefacts
Neutral particle lithography (NPL) is a high resolution, proximity exposure technique where a broad beam of energetic neutral atoms floods a stencil mask and transmitted beamlets transfer the mask pattern to resist on a substrate. It preserves the advantages of ion beam lithography, including extremely large depth-of-field, sub-5 nm resist scattering, and the near absence of diffraction, yet is...
متن کاملAmorphous Silicon Direct Bonding (a-SDB) with Improved Surface Roughness
Silicon direct bonding (SDB) is a bonding technique of two silicon wafers together with homogeneous or heterogeneous layers without the use of any intermediate adhesives. The SDB technique simplifies the process and cost by reducing mask level, and its necessity has increased in terms of its fields of applications such as power devices, SOI, sensors and actuators. Factors which can affect direc...
متن کاملAn Experimental Investigation on Surface Roughness and Edge Chipping in Micro Ultrasonic Machining
Surface quality including surface roughness and edge chipping is a key process measure in micro ultrasonic machining (Micro-USM) as an efficient process for micromachining of hard and brittle materials. Process parameters such as ultrasonic vibration amplitude, static load, type of tool material, type and size of abrasive particles and slurry concentration can influence the surface quality. How...
متن کاملAn Experimental Investigation on Surface Roughness and Edge Chipping in Micro Ultrasonic Machining
Surface quality including surface roughness and edge chipping is a key process measure in micro ultrasonic machining (Micro-USM) as an efficient process for micromachining of hard and brittle materials. Process parameters such as ultrasonic vibration amplitude, static load, type of tool material, type and size of abrasive particles and slurry concentration can influence the surface quality. How...
متن کامل